The AI revolution is accelerating, expanding from the data center to the edge, and becoming foundational to every application we use. This transformation demands a new generation of semiconductors with unprecedented performance and energy-efficiency. TSMC is driving this transformation by pioneering advanced process and packaging technologies, while collaborating closely with our design ecosystem partners to enable cutting-edge chip innovations that will proliferate AI for the future.

Enabling Energy-Efficient Chip Innovations

TSMC’s N2 and A16™ technologies lead the industry in addressing the insatiable demand for energy-efficient computing. Our N2 is on track for volume production in the second half of 2025, followed by N2P, an extension of our 2nm family that will deliver even greater performance and power efficiency.

Meanwhile, our A16 technology—featuring the revolutionary Super Power Rail (SPR) architecture—is specifically optimized for HPC products with complex signal routes and dense power delivery networks. Together, N2, N2P, A16, and their derivatives will fuel our 2nm family to be another large and long-lasting node that drives industry-wide innovation.

We unveiled A14 technology at our Technology Symposium this April. Representing a full-node leap beyond N2, A14 features our second-generation nanosheet transistor structure to deliver exceptional performance and power benefits. Compared to N2, A14 will provide 10-15% speed improvement at the same power, or 25-30% power savings at the same speed, along with a ~20% chip density gain. With volume production targeted for 2028, A14 is designed to address the growing structural demands for high-performance and energy-efficient computing.

Establishing a Leading-Edge Semiconductor Cluster in the U.S.

To meet the robust and sustained demand from our customers, we recently announced our intention to invest a total of US$165 billion in advanced semiconductor manufacturing in the U.S. This expansion includes plans for six advanced wafer manufacturing fabs, two advanced packaging fabs, and a major R&D center, all contributing to the completion of the AI supply chain and laying the groundwork for a state-of-the-art GIGAFAB^® cluster in Arizona. Once completed, approximately 30% of our 2nm and more advanced manufacturing capacity will be located in Arizona, creating an independent, leading-edge semiconductor manufacturing cluster in the U.S. that will support our customers across smartphone, AI, and HPC applications.

Proliferating AI Innovation Through a Robust Design Ecosystem

AI chip innovation thrives not only on cutting-edge technologies but also on a collaborative and vibrant design ecosystem. On September 24^th, we will kick off the 2025 Open Innovation Platform^® (OIP) Ecosystem Forum in Santa Clara, California, where our ecosystem partners will showcase the latest AI-optimized solutions that drive energy-efficient semiconductor designs and push the boundaries of AI innovation. I look forward to seeing many of you there.

We have an incredible opportunity in front of us! Together, we have the power to redefine what’s possible in AI innovation, empowering industries and shaping a brighter future for generations to come.