TSMC Leads Industry in Production of 0.13-um FSG and Low-K Products

High Volume Manufacturer of Advanced Technology Semiconductors Also Pushes 90-nm Performance Barriers

Hsinchu, Taiwan and San Jose, CA, April 17, 2003 -

Taiwan Semiconductor Manufacturing Company (TSE: 2330, NYSE: TSM), today announced new production data on its 0.13-um processes as well as its status for 90-nm process.

With more than 230 product designs taped out to its 0.13-um processes and more than 100,000 0.13-um eight-inch equivalent wafers shipped to date, TSMC leads the industry in advanced technology volume production. Furthermore, TSMC’s 0.13-um low-k process technology is the first in the foundry industry to pass customer product qualifications and enter volume production.

On the 90-nm front, TSMC has recorded more than twenty customer projects that are at various design stages. Production for customers using TSMC’s NexsysSM 90-nm technology with copper and low-k dielectrics on more cost-competitive 300mm wafers is expected to start in the third quarter of 2003.

“The successful ramp of our 0.13-um process technology for use by customers in a wide variety of market segments, and the recent availability of our NexsysSM 90-nm process, are examples of realizing TSMC’s vision: ‘To be the most advanced, innovative and largest provider of foundry services, and in partnership with our customers, to forge a most powerful force in the semiconductor industry,” said Dr. Rick Tsai, president and COO of TSMC.

“To realize this vision, we must be a technology leader, competitive with other industry leaders,” continued Dr. Tsai. “Just as important, we must be the manufacturing leader, with the best reputation, best services, and greatest total-benefits to our customers. What we have achieved in the past creates solid foundation for TSMC to go after this vision.”

The 230-plus 0.13-um customer design tape outs span products in the consumer, computer and communications markets. TSMC anticipates to ship more than 400,000 eight-inch equivalent wafers in 0.13-um technology this year. By the end of 2003, the monthly installed capacity for 0.13-um technology at TSMC Fab 12, a 300mm-wafer fab, is expected to reach approximately half of TSMC’s total monthly installed capacity for 0.13-um technology. The company expects 20 percent of its revenues will come from 0.13-um products for 2003.

“There is a big difference between having the capability to demonstrate novel semiconductor technology and being able to produce in a manufacturing line with good yields,” said Genda Hu, vice president of marketing for TSMC. “TSMC has consistently demonstrated two of our core strengths: delivering a highly manufacturable process to our customers, and supporting that process with customer-oriented services. TSMC has taken a noticeable lead in both areas for 0.13-um node. Furthermore, with the success of our volume production and product qualification of the low-k dielectric process, we fully anticipate similar success at 90-nm and beyond.”

TSMC’s multiple process options for the 0.13-um and NexsysSM 90-nm technologies will be presented at TSMC 2003 Technology Symposia held in North America, Asia, and Europe. The first symposium will be held in San Jose, California on April 22nd.

TSMC Low-K Status A number of companies are using TSMC’s low-k, 0.13-um technology in volume production, two of which, LSI Logic and Agere Systems, have announced product qualification. In addition, packaging vendors ASE and Amkor have collaborated extensively with TSMC and qualified their packages for 0.13-um low-k process.

The advantage of low-k dielectrics is significant for certain designs. Agere Systems, which recently announced that it is using TSMC’s low-k based 0.13-um process for its DSP16411 digital signal processor (DSP) chips, now in volume production, has reported a performance improvement of 20 percent and a power savings of another 20 percent compared to competitor chips without the low-K technology.

TSMC 90-nm Status TSMC acknowledges that, to date, more than twenty 90-nm customer projects are at various design stages. Fully functional 90-nm test chips were successfully produced in the fourth quarter of 2001. Production for customers using TSMC’s NexsysSM 90-nm technology with copper and low-k dielectrics on more cost-competitive 300mm wafers is expected to start in the third quarter of 2003.

Other notable milestones of TSMC’s 90-nm process development include: · Delivery of 90-nm design rules to key EDA Alliance members in 2001 · Early validation of Library and IP Alliance member products in 2002 · Multiple customer designs verified with TSMC’s CyberShuttle service to date

About TSMC TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fabs (VIS and SSMC) and at its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC's corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC see http://www.tsmc.com.

# # # Safe Harbor Notice: The statements included in this press release that are not historical in nature are "forward-looking statements" within the meaning of the "safe harbor" provisions of the Private Securities Litigation Reform Act of 1995. TSMC cautions readers that forward-looking statements are subject to significant risks and uncertainties and are based on TSMC’s current expectations. Actual results may differ materially from those contained in such forward-looking statements for a variety of reasons including, among others, risks associated with cyclicality and market conditions in the semiconductor industry; demand and supply for TSMC’s foundry manufacturing capacity in particular and for foundry manufacturing capacity in general; intense competition; the failure of one or more significant customers to continue to place the same level of orders with us; TSMC’s ability to remain a technological leader in the semiconductor industry; TSMC’s ability to manage its capacity; TSMC’s ability to obtain, preserve and defend its intellectual property rights; natural disasters and other unexpected events which may disrupt production; and exchange rate fluctuations. Additional information as to these and other risk factors that may cause TSMC’s actual results to differ materially from TSMC’s forward-looking statements may be found in TSMC’s Annual Report on Form 20-F, filed with the United States Securities and Exchange Commission on May 9, 2002, and such other documents as the Company may file with, or submit to, the SEC from time to time.