TSMC invites you to join our 2025 Technology Symposium to explore how semiconductor technologies are advancing the AI future. Get the latest news on TSMC’s advanced logic technology, 3DFabric® advanced silicon stacking and packaging technology, and specialty technology. Learn about TSMC’s commitment in our manufacturing excellence and explore the depth of our comprehensive ecosystem that fuels the industry’s cutting-edge solutions. Event registration is now open for the TSMC NA Symposium.
Advancing the Future of AI

David Keller, Chief Executive Officer, TSMC North America
The rapid advancements in artificial intelligence (AI) are reshaping industries and redefining possibilities, with semiconductor technology serving as the foundation for these transformative capabilities and applications. At TSMC, we are proud in driving these breakthroughs with our state-of-the-art technologies.
To support this transformation, we intend to expand our U.S. investment to $165 billion, including an additional $100 billion for three new fabs, two advanced packaging facilities, and a major R&D team center. This historic investment is set to generate hundreds of billions of dollars in semiconductor value for AI and other cutting-edge applications. It stands as a testament to TSMC’s unwavering commitment to empowering customer innovation with the most advanced technologies and capacity, enabling them to seize the tremendous growth opportunities in the AI-driven era.
Building on our technology leadership, we continue to deliver innovations that empower our customers and fuel the progress of AI. Our most advanced N2 and A16 technologies lead the industry in addressing the insatiable need for energy-efficient computing. A16, featuring our innovative Super Power Rail (SPR), is ideal for HPC products with complex signal routes and dense power delivery networks. These advancements will drive your success in the AI era.
Globally, TSMC continues to expand to meet the growing needs of our customers. In Arizona, our first fab began high-volume production in the fourth quarter of 2024, utilizing N4 process technology, with a yield comparable to our fabs in Taiwan. Plans for the second and third fab in Arizona are progressing, and these fabs will utilize even more advanced technologies, such as N3 and beyond, driven by customer demand. In Japan, our first specialty technology fab in Kumamoto began volume production at the end of 2024, and we are on track with the second fab. In Europe, we are advancing our plans for a specialty fab in Dresden, Germany, focusing on automotive and industrial applications.
We warmly invite you to the 2025 TSMC North America Technology Symposium on April 23rd, where we will showcase our latest technology innovations and explore how we can help you achieve your goals in the AI era.
Thank you for your continued partnership. We look forward to working together with you to advance the future of AI.

